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1.
Preparing the PCB: First, the assembler places solder paste where it is needed on board.
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2.
Placing the components: Next, the assembler places the components on the board, typically using a pick-and-place machine.
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3.
Reflow soldering: The assembler then heats the boards in a reflow oven until the solder paste reaches the temperature required for the solder joints to form.
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4.
Inspection: he assembler conducts inspections throughout the SMT process, including before attaching the components and before and after reflow soldering.